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Form Factor | | Dimensions | - 12" x 13" (30.48cm x 33.02cm)
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CPU | - Intel¢ç Xeon¢ç Scalable Processors.
- Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
- CPU1: Skylake-F CPU supporte
| Cores / Cache | | | |
Memory Capacity | - Up to 2TB 3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
| Memory Type | - 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
| DIMM Sizes | - RDIMM: 64GB
- LRDIMM: 64GB
- 3DS LRDIMM: 128GB
| Memory Voltage | | Error Detection | - Corrects single-bit errors
- Detects double-bit errors (using ECC memory)
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Chipset | | SATA | - Intel¢ç C622 controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
| IPMI | | Network Controllers | - Dual LAN with 10GBase-T with Intel¢ç X722 + X557
| Graphics | | | |
USB | - 2 USB 2.0 ports (2 rear),
- 5 USB 3.0 ports (2 rear + 2 via header(s) + 1 Type A)
| Video Output | | Serial Port / Header | - 2 COM Ports (1 rear, 1 header(s))
| TPM | |
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PCI-E | - 4 PCI-E 3.0 x16,
- 2 PCI-E 3.0 x8
| M.2 | - Interface: PCIe 3.0 x4
- Form Factor: 2260, 2280, 22110
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Software | - Intel¢ç Node Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor¢ç 5, Watchdog
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Voltage | - +1.8V, +12V, +3.3V, +5V, +5V standby
| FAN | - 8x 4-pin fan headers (up to 8 fans), Pulse Width Modulated (PWM) fan connectors, PWM fan speed control
| Temperature | | LED | | Other Features | - Chassis intrusion detection, CPU thermal trip support for processor protection, Node Manager Support, RoHS
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Operating Temperature Range | - 0¡ÆC ~ 50¡ÆC (32¡ÆF ~ 122¡ÆF)
| Non-Operating Temperature Range | - -20¡ÆC ~ 60¡ÆC (-4¡ÆF ~ 140¡ÆF)
| Operating Relative Humidity Range | - 10% ~ 85% (non-condensing)
| Non-Operating Relative Humidity Range | - 10% ~ 95% (non-condensing)
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